Projects
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"Mikrométeres foltméretű ellipszométeres mérőautomata fejlesztése korszerű dielektrikumok és rétegszerkezetek vizsgálatára" KMOP-1.1.1-09/1-2009-0043 Közerműködő szervezet: |
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„Gyártósori szilícium szelet szennyezés vizsgáló mérőautomata fejlesztése a mikroelektronikai ipar számára” Description of the project: Within this project, measurement methods used for semiconductor wafer and dielectric characterization will be integrated to a fully automated platform with one front loadport. This tool will be suitable for silicon wafer manufacturers and mid-range IC manufacturing companies. KMOP-1.1.4-07/1-2008-0049 Közerműködő szervezet: |
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„Szeletosztályozó automata fejlesztése a napelemipar számára” KMOP-1.1.1-08/1-2008-0056 Közerműködő szervezet: |
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„Elektromos és optikai elvű mérőkészülék család fejlesztése vékonyréteg napelemek gyártásközi és laboratóriumi minősítésére” Description of the project: Semilab Co. Ltd. is an accepted supplier of the major crystalline silicon solar cell manufacturers. The strategic aim of Semilab is to develop successful metrology solutions in the area of the thin film solar cells, and thereby to hold the market leader's position. The fast evolution of the newly developed manufacturing technologies requires continuous development of measuring tools, and the presence of strong R&D base. During the project a new range of qualification tools for thin film solar cells will be created. PVMET_08 Közerműködő szervezet: |
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„32nm-es generációjú mikroelektronikai technológiák integrált folyamatellenőrző mérőberendezéseinek kifejlesztése” Description of the project: SEMILAB Inc. is an accepted metrology supplier of silicon wafer manufacturers and the major solar cell manufacturers, but the presence of the Semilab’s products on the market of integrated circuit manufacturers is minor. The strategic aim of Semilab is to become supplier of the top IC manufacturers. The requirements of the IC manufacturers on stability of measurement equipments and the fast development of measurement techniques and automation, requires continuous development of measuring tools, and the presence of strong R&D base. During the project, integrated and fully automatic measurement equipment will be developed for implant dose monitoring, according to the actual ITRS 32-65nm technology node of IC manufacturing needs. ICMET_07 Közerműködő szervezet: |
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Kereskedelemfejlesztési pályázatok: a. „A” Külföldi kiállításon való részvétel: Supported by ITD Hungary Ltd. – Hungarian Investment and Trade Development Agency |
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„Mérési módszer és berendezés fejlesztése szilícium karbid vizsgálatára” Description of the project: Semilab Co. Ltd. has been a supplier in carrier lifetime measurements for silicon wafers, but the advancement in the microelectronic industry lead to the usage of other materials such as silicon carbide. To keep the earned market share and enable future growth, a measurement method and a tool will be developed within this project to provide solutions for silicon carbide metrology needs. GVOP-3.3.3-05/2.-2006-01-0078/3.0. |
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„Tisztatéri mérőautomata kifejlesztése a mikroelektronikai ipar számára” Description of the project: Semilab Co. Ltd. has a wide range of measurement technologies for the semiconductor industry; however these measurements were only available in a table-top tool, which was not suitable for high volume IC manufacturers. During the project, a fully automated in-line metrology platform will be developed, thus integration of conventional and new Semilab metrologies will be possible even in an in-line production environment. This platform with two front loadports will address the needs of high-end users, and will be compatible with relevant industry standards for hardware and software. GVOP-3.3.3-05/2.-2006-01-0067/3.0. |
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„Érintésmentes rétegellenállás térképező berendezés kifejlesztése” Description of the project: Characterization of sheet resistance of silicon wafers with pn junctions has a great importance for both the microelectronic and the photovoltaic industry. In microelectronics, sheet resistance measurements are used to control the ion implantation and annealing process, while in solar cell manufacturing, these measurements are used to monitor the diffusion process. During this project, a non-contact sheet resistance measurement method will be developed together with mm resolution mapping capability to meet the requirements of IC and solar cell manufacturers. GVOP-3.1.1-2004-05-0282/3.0. |
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„Mérési módszer és berendezés fejlesztése szilícium szeletek dielektrikum/oxid rétegének jellemzésére” Description of the project: Controlling the quality of the dielectric layer deposited on silicon wafers is a key element of integrated circuit manufacturing. Within this project, Semilab will develop a non-contact, non-destructive method to monitor various properties of dielectric layers. GVOP-3.3.3-2004-04-0019/3.0. |
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„Nagyérzékenységű spektroszkópiai módszerek fejlesztése környezetvédelmi és anyagtudományi alkalmazásokra” Description of the project: Based on the knowledge of Department of Optics an Quantum Electronics of the University of Szeged, the goal of the project is to develop measurement systems for solving problems – such as measuring and controlling impurities concentration and distribution in gases liquids and solid materials – relevant for the environmental protection as well as the microelectronics industry. Applying the photoacoustic method for continuous and on-line monitoring the hydrogen-sulfide concentration in natural gas, to monitor and control the composition of feed gas for gas motors and to detect the BTX pollution of ground water. The aim of the project, regarding the materials science part of the proposal, is the development of a non-contact optical method based on photoluminescence for characterizing direct and indirect type semiconductor materials. By the application of this method we plan the construction of semiconductor wafer mapping systems. The research and development will be carried out in fact in two directions. Techniques will be developed for characterization of i) optoelectronic materials and structures and ii) silicon thin (EPI) layers and thin film solar cells. 3A/046/2004 |
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National Office for Research and Technology: www.nkth.gov.hu
Hungarian Investment and Trade Development Agency: www.itd.hu