MCV-2500 / MCV-530
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The MCV automatic mapping systems provide a mercury C-V measurement for non-patterned wafers used in epitaxial silicon production and front-end semiconductor processing.
In MCV-2500, Wafers are robotically loaded onto the mapping stage from a cassette or opened FOUP. The test wafer moves to each site specified in a pre-programmed map as electrical characterization tests are made. The system stores test data and reports it in a variety of formats.
The MCV 530 system has the same abilities, however it does not have a robot. MCV-530 can measure wafers up to 300 mm size, while MCV-530L can measure maximum 200 mm wafers.
The MCV systems eliminate the need for costly metal and poly deposition processes by using a pneumatically controlled, non-damaging probe design and a top-side mercury contact. With separate probe and chuck vacuum lines, the system features an extremely stable contact area and uses only a small quantity of mercury to make highly repeatable measurements for process development and process monitoring applications.
Typical MCV applications
- EPI resistivity
- Low-k dielectric constant
- Oxide integrity
