Wafer Surface Measurement System
Printer-friendly version
The Solar Cell Wafer Surface Measurement System is a complete system for surface quality control. The wafers are checked for chipping, edge defects, glue residues, microcrystals and contamination.
The solution is built on Scorpion Vision Software® for user friendliness, configurability, reliability, flexibility and ease of maintenance. The system includes off-the-shelf world class hardware components such as area- and line-scan camera technology. The system is a standard instrument and easy to interface to any production line system.
Complete Surface Quality Control
- Chipping, both sides of wafer
- Edge defects
- Glue residue
- Microcrystals
- Contamination
- Shiny patches
Chipping and Edge Defect Measurement
Edge defects are visible from both sides of the wafer. Chipping is missing material visible from only one side of the wafer. To detect chipping we use angled lighting to make the chipping areas darker. We measure the size of the chipping and reliably reject the wafers. The algorithms are able to distinguish shiny patches from chipping.
Microcrystal Measurement
Microcrystals are detected if a minimum number of crystals are present within a certain area anywhere on the wafer. The wafers are classified using an advanced Scorpion Vision Software® texture matcher tool.
Wafer Contamination Measurement
We are scanning the wafer for contamination. Special purpose lighting removes crystals in the image and the contamination is clearly visible on the wafer image.
Complete wafer inspection system
The high precision, reliable and compact wafer surface measurement solution is built on the Scorpion Vision Software platform with 2D and 3D machine vision capabilities. The interface to the automation and data collection system is extremely flexible. Off-the-shelf world class hardware components including area- and line scan camera technology are used.
Optimal Wafer Location using PolygonMatch™ Technology
Reliable wafer measurements are guaranteed with PolygonMatch™ technology used to find the position and rotation and size of the wafer with sub-pixel accuracy. Optimal location is needed for high precision measurement and defect detection.
System Configuration
The system is delivered with either one sided or two sided measuring capabilities. The measurement resolution is either 40 µm or 80 µm. Contamination measurements are optional.
Flexible Interfaces
- TCP/IP, RS-232, Profibus or other industry standard interfaces for delivery of inspection results and system status
- OPC support
- Logging of inspection results
- Statistics presentation - Pareto Graphs
