Metal Layer

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The Semilab AMS 3300 uses the exclusive SurfaceWave™ technology to measure the thickness and uniformity of thin film metals . It’s a low cost but powerful product built expressly for copper.

The 3300 delivers high-throughput, non-contact, non-destructive measurements of the thickness and uniformity of metal line arrays and pads for all copper. The 3300 is capable of incredible speed and accuracy at the 65 nm node and lower for maximum scalability and the lowest cost of ownership in its class.

Products: 

SW-3300